Micro Skiving
High Density copper Skived Fin Copper Heatsink
In the high density fin skiving process, fins are machined using special skiving or scraping tooling, whereby extreme precisely sliced layers from an Copper block are bent at the base of the slice to form slender curved fins. Since the fins and base are an integral unit, the interface resistance seen in folded and bonded heat sinks is not present.
The depth of cut determines the fin thickness and can be as low as 50µm thick, resulting in extremely thin fin structures, yielding light and competitive heat sink designs for high performance applications like CPU's Servers CPU's, 5G aaplications, etc.
Standard Heatsinks,PTNS01 Socket R Server Heatsink,PTNS02 Socket R Passive Heatsink Server Cooler,PTNV01 Socket R Copper Server Heatsink,PTNG01 Socket R Copper Server Cooler,PTNS01 Socket R CPU Server Heatsink,PTNS01 Socket R Server CPU Heatsink with Fan,PTSS01 Platform: Socket R&B Active Heatsink,PT5S01 Socket H&H1&H2&H3 Active Cooler,PT5G01 Socket H&H1&H2&H3 Skived Fin Heatsinks